Foreword

Power electronics continues to evolve rapidly and in this edition, we highlight several technologies that are helping engineers create smarter, smaller and more efficient designs.

From high-performance and high density operational amplifiers and efficient MOSFETs to compact power adapters and high-voltage connectors, each innovation offers new opportunities to improve efficiency, power density, thermal performance and long-term system reliability.

With electronica 2026 just around the corner, we are also looking forward to reconnecting with customers, suppliers and technology partners in Munich. 

It is always fun and a great opportunity to exchange ideas, discuss design challenges and explore what is next in electronics.

We hope this newsletter gives you some inspiration for your next project. We look forward to meeting many of you at electronica!

On behalf of the TOP-team

Arco Snoey, CEO & Founder of TOP-electronics

Your global distribution partner with local technical expertise

Ultra-Slim adapter series - FSP Group

FSP's U3 Ultra-Slim adapter series is now available from 90W up to 460W.  
Some models are smaller than many smartphones, yet deliver high power density and over 90% efficiency.

With global safety certifications, protection features, and customization options, the U3 series is ideal for gaming, embedded, edge AI, industrial, and POS applications. 

Intelligent power protection for high-current systems - MaxLinear

MaxLinear's MxL745950 and MxL745951P intelligent eFuses deliver up to 50 A and 60 A protection with low on-resistance.

The MxL745950 and MxL745951P are the first two devices in MaxLinear’s planned eFuse portfolio, with additional models expected to follow.

The MxL745951P adds PMBus/I²C telemetry, programmable protection and fault logging, helping engineers improve power distribution reliability in AI servers and networking equipment.

Precision IC - Apex Microtechnology

Apex Microtechnology expands its Precision IC portfolio with three new power operational amplifiers: the PA167, PA168 and PA169.  

Housed in a compact 20 × 20 mm PQ package, they deliver up to 20% higher thermal performance and offer a wider range of current capabilities.  

The new devices help engineers design high-density, high-voltage systems without compromising on board space or reliability.  

High power density MOSFETs - Goford

As power converters and inverters become smaller and more powerful, MOSFET selection is critical.  

GOFORD's GT100N20TT combines low RDS(on), low gate charge and high power density in a compact TOLT package.  

The result is higher efficiency, reduced switching losses and greater design flexibility for energy storage systems, motor drives and advanced inverter designs.

High-voltage connectors - Degson

DEGSON Series 1800 2 PIN high-voltage connectors offer 90° and 180° cable exits for flexible system integration.

Rated up to 280A at 85°C, they feature HVIL safety, four coding options, IP6K9K protection and USCAR-2 V2 vibration certification.

Operating from -40°C to +125°C, they are designed for commercial EVs, battery packs, energy storage systems and power distribution units.

Let's connect at electronica 2026!

Are you attending electronica in Munich this November? We would love to meet you!

Let's discuss your current projects, explore new technologies and discover how TOP-electronics can support your next design, from component selection to system integration.

Let's make the most of electronica 2026
Schedule a meeting with our team in Conference Room A36 to discuss your projects, explore new technologies and discover opportunities for collaboration.

And there's more...

For more than 20 years, we have supported engineering teams from concept to volume production, combining proven technologies and components with technical expertise, design support and long-term supply continuity.

Explore our product portfolio, discover the technologies behind it and discuss your current design challenges with our specialists.

We love to connect... engineers and technology